Comparison of Electrochemical Polishing Treatments between Phosphoric Acid and a Deep Eutectic Solvent for High-Purity Copper

This study investigated and compared the acid-free electropolishing of copper with state-of-the-art acidic process. The medium used in this is based on a deep eutectic solvent comprised 2:1 ethylene glycol choline chloride. electrochemical included voltammetry chronoamperometry tests during characterization techniques were atomic force microscopy (AFM) digital microscopy, surface morphology comparisons summarized efficiency phosphoric acid treatments for high-purity copper. Electropolishing resulted mirror finish post-treatment that was 8× smoother than original metal prior to smoothing 91.1 ± 1.5%. eco-friendly solution produced polished surfaces superior those treated industry standard electrochemistry 1 M H3PO4.